Other articles related with "thermal analysis":
108101 Shi-Zheng Yang(杨施政), Hong-Liang Lv(吕红亮), Yu-Ming Zhang(张玉明), Yi-Men Zhang(张义门), Bin Lu(芦宾), Si-Lu Yan(严思璐)
  Efficient thermal analysis method for large scale compound semiconductor integrated circuits based on heterojunction bipolar transistor
    Chin. Phys. B   2018 Vol.27 (10): 108101-108101 [Abstract] (541) [HTML 1 KB] [PDF 2105 KB] (171)
94208 Jun-Jie Hu(胡俊杰), Shu-Ming Zhang(张书明), De-Yao Li(李德尧), Feng Zhang(张峰), Mei-Xin Feng(冯美鑫), Peng-Yan Wen(温鹏雁), Jian-Pin Liu(刘建平), Li-Qun Zhang(张立群), Hui Yang(杨辉)
  Thermal analysis of GaN-based laser diode mini-array
    Chin. Phys. B   2018 Vol.27 (9): 94208-094208 [Abstract] (626) [HTML 1 KB] [PDF 3381 KB] (207)
120505 Xue-Tao Cheng(程雪涛), Xin-Gang Liang(梁新刚)
  Role of entropy generation minimization in thermal optimization
    Chin. Phys. B   2017 Vol.26 (12): 120505-120505 [Abstract] (755) [HTML 1 KB] [PDF 317 KB] (230)
86501 Yong-Guang Cheng(程永光), Yan-Chao Mao(毛彦超), Xain-Sheng Liu(刘献省), Bao-He Yuan(袁保合), Ming-Ju Chao(晁明举), Er-Jun Liang(梁二军)
  Near-zero thermal expansion of In2(1-x)(HfMg)xMo3O12 with tailored phase transition
    Chin. Phys. B   2016 Vol.25 (8): 86501-086501 [Abstract] (591) [HTML 1 KB] [PDF 517 KB] (332)
68105 Alexander Hanß, Maximilian Schmid, E Liu, Gordon Elger
  Transient thermal analysis as measurement method for IC package structural integrity
    Chin. Phys. B   2015 Vol.24 (6): 68105-068105 [Abstract] (562) [HTML 1 KB] [PDF 6145 KB] (2245)
4273 Cheng Ying (程 营), Huang Qiao-Jian (黄巧建), Liu Xiao-Jun (刘晓峻)
  Finite element analysis of three-dimensional laser-induced transient thermal grating in diamond/ZnSe system
    Chin. Phys. B   2008 Vol.17 (11): 4273-4278 [Abstract] (1470) [HTML 0 KB] [PDF 1440 KB] (582)
2158 Zhao Chun(赵纯), Zhang Qin-Yuan(张勤远), Pan Yue-Xiao(潘跃晓), and Jiang Zhong-Hong(姜中宏)
  Effects of Nb2O5 on thermal stability and optical properties of Er3+-doped tellurite glasses
    Chin. Phys. B   2006 Vol.15 (9): 2158-2164 [Abstract] (1213) [HTML 1 KB] [PDF 226 KB] (587)
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